To solder a CubeNode onto a PCB, you can do the following:
- Prepare "no clean" soldering paste to remove the need for post-soldering PCB cleaning.
- Prepare a convention-type soldering oven. This allows for more precise temperature control compared to an infrared-type radiation oven.
- Configure the oven settings.
{% hint style="warning" %}
- Take into account the following for the final soldering temperature:
- Soldering paste type
- Baseboard size, thickness, and material properties
- Do not exceed the peak temperature of the recommended soldering profile.
- Do not use a damp heat process during the soldering. {% endhint %}
- Bake the PCB.
- Preheat the PCB to remove all the residual humidity using the following parameters:
- Temperature rise rate: Max 3 °C/s
- Time: 60 ~ 120 s
- End temperature: 150 ~ 200 °C
{% hint style="warning" %}
- Insufficient preheating causes large solder balls to be formed.
- Excessive preheating can lead to both fine and large solder balls clustering. {% endhint %}
- Perform the heating-flow to the PCB with the following parameters:
- Time limit above 217 °C liquidus temperature: 40 ~ 100s
- Peak reflow temperature: 245 °C
{% hint style="warning" %} Avoid sudden temperature increases to prevent solder paste slump. {% endhint %}
- Perform a controlled cooling process to cool the PCB with the following parameters:
- Temperature fall rate: Max 4 °C/s
{% hint style="warning" %} A controlled cooling process prevents the solder from becoming brittle. {% endhint %}
- It is recommended to conduct an optical inspection after the soldering.
- PCB cleaning is recommended if a soldering paste other than "no-clean" was used.
{% hint style="warning" %} Do not clean the PCB with the following:
- Water (may cause short-circuits)
- Alcohol or organic solvent (may leave inaccessible residues)
- Ultrasonic cleaner (may cause permanent damage) {% endhint %}