In the project README, you say: ”For the 4 MB version, solder U7 and U8 only and use the dedicated firmware.”
This seems to be valid for the v2 firmware source (only RAS2 and RAS3 used, when 4MB is defined).
However, for v1 firmware it is the opposite, if I understand well the code: comments indicate to remove the case statements corresponding to RAS2 and RAS3. Hence I would believe RAS0 and RAS1 are used in this case. So 4Mb version of v1 firmware would require to solder U5 and U6, correct?
In the project README, you say: ”For the 4 MB version, solder U7 and U8 only and use the dedicated firmware.”
This seems to be valid for the v2 firmware source (only RAS2 and RAS3 used, when 4MB is defined).
However, for v1 firmware it is the opposite, if I understand well the code: comments indicate to remove the case statements corresponding to RAS2 and RAS3. Hence I would believe RAS0 and RAS1 are used in this case. So 4Mb version of v1 firmware would require to solder U5 and U6, correct?