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Final enrichment: Added NASA research media to CPU and GPU pages using ingest tool
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cpu.html

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data/cpu.json

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{
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"assets": [
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{
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"id": "1033577240472324186",
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"filename": "pro-imagery-submittal-radiation-harden-gan.jpg",
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"local_path": "assets/images/cpu/pro-imagery-submittal-radiation-harden-gan.jpg",
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"type": "image",
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"license": "NASA Public Domain",
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"creator": "JSC",
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"source_url": "http://images-assets.nasa.gov/image/jsc2025e015684/jsc2025e015684~orig.jpg",
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"retrieved_at": "2026-03-05T22:51:46.429236",
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"checksum": "e3254cd8b28bf0ee57bb800d0a31ef6d0f5d2d5273bb88b13d55afc5ed114b9a",
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"caption": "PRO Imagery Submittal - Radiation Harden GaN",
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"alt_text": "jsc2025e015684 (3/6/2025) --- The Radiation Harden GaN research team in the lithography room where p"
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},
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{
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"id": "7939305359688930829",
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"filename": "pro-imagery-submittal-radiation-harden-gan.jpg",
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"local_path": "assets/images/cpu/pro-imagery-submittal-radiation-harden-gan.jpg",
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"type": "image",
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"license": "NASA Public Domain",
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"creator": "JSC",
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"source_url": "http://images-assets.nasa.gov/image/jsc2025e015690/jsc2025e015690~orig.jpg",
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"retrieved_at": "2026-03-05T22:51:51.653788",
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"checksum": "385076aad85ea5f000d3e020cb2c023f181320020a78f71ef6b684d6f488e053",
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"caption": "PRO Imagery Submittal - Radiation Harden GaN",
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"alt_text": "jsc2025e015690 (3/6/2025) --- An overview of the prototype with the various components as part of th"
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}
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],
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"scholarly_links": [],
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"last_updated": "2026-03-05T22:51:51.654821"
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}

data/gpu.json

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{
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"assets": [
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{
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"id": "3644036380177476258",
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"filename": "silicon-carbide-integrated-circuit-chip.jpg",
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"local_path": "assets/images/gpu/silicon-carbide-integrated-circuit-chip.jpg",
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"type": "image",
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"license": "NASA Public Domain",
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"creator": "GRC",
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"source_url": "http://images-assets.nasa.gov/image/GRC-2015-C-00595/GRC-2015-C-00595~orig.jpg",
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"retrieved_at": "2026-03-05T22:51:59.899969",
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"checksum": "c4c26e0cb830fa3ac3d92f6154bcc4538864f334a046c04000e392a181b5c81f",
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"caption": "Silicon Carbide Integrated Circuit Chip",
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"alt_text": "A multilevel interconnect silicon carbide integrated circuit chip with co-fired ceramic package and "
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},
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{
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"id": "-4756197828434361466",
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"filename": "grc-2015-c-00598.jpg",
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"local_path": "assets/images/gpu/grc-2015-c-00598.jpg",
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"type": "image",
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"license": "NASA Public Domain",
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"creator": "GRC",
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"source_url": "http://images-assets.nasa.gov/image/GRC-2015-C-00598/GRC-2015-C-00598~orig.jpg",
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"retrieved_at": "2026-03-05T22:52:07.578744",
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"checksum": "a0c2f5482e584533674fa82eb6db88feb05ae993e6f6c8d46b83cdcd7c1e87c6",
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"caption": "GRC-2015-C-00598",
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"alt_text": "Silicon Carbide, SiC wafer v8.1 OpAmp Chip in Co-fired Alumina Package for High-temperature Applicat"
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}
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],
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"scholarly_links": [],
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"last_updated": "2026-03-05T22:52:07.580178"
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}

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