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README.md

PowerConversionBoardPower Management & Conversion

This board is responsible for powering the entire system.
It performs battery voltage step-down conversion and distributes regulated voltage rails to all modules.

⚠️ Status: Requirements definition The module is currently in the specification phase. System power requirements, voltage rails, and load characteristics are being defined prior to schematic design.

🔧 Goal: Serve as an educational platform for learning switch-mode power supply (SMPS) design, including DC-DC conversion topologies, control loop design, component selection (inductors, MOSFETs, drivers), efficiency optimization, thermal management, and EMI/EMC considerations.


🔧 Power Architecture

The system is based on multiple independent high-efficiency buck converters:

  • TPS40170RGYR – used for 5 V / 6 V rails
  • LM5146 – dedicated 12 V rail
  • LTC3774 – high-current 7.4 V rail (main output)

The main 7.4 V rail is planned as a multiphase converter (2–4 phases) to:

  • distribute thermal load
  • reduce ripple current
  • improve efficiency at high output currents (~40 A)

Final phase count will be determined during detailed design and validation.


🛑 Safety & Control

The board includes a hardware kill switch input, allowing immediate shutdown of selected power rails:

  • 12 V
  • 6 V
  • 7.4 V

This mechanism is implemented entirely in hardware and does not rely on any MCU, ensuring deterministic and fail-safe operation.


🧠 Design Approach

The PowerConversionBoard is designed as a fully standalone hardware module:

  • no microcontroller
  • no firmware dependency
  • all control loops implemented using analog controllers

This approach ensures:

  • predictable real-time behavior
  • high reliability
  • independence from the rest of the system

⚠️ Design Status

The design is currently in an early stage.

At this point:

  • Power requirements and load distribution are defined
  • Key controller ICs have been selected
  • High-level architecture (including multiphase design for the main rail) is established

The following aspects are still under development:

  • Inductor and power stage component selection
  • Thermal design and efficiency estimation
  • Input filtering and protection circuitry
  • PCB layout strategy (high-current paths, grounding, EMI considerations)