采集日期：2026-05-08
本文档记录 SK hynix managed NAND 中 eMMC / e-NAND 料号的公开资料、规则库抽象和 testcase 覆盖点。实现禁止按完整 PN 白名单匹配，应按结构切 token，再用规则库解释已知 token；未知 revision/config token 不应阻断 vendor/type/density 等已知字段解析。
- SK hynix eMMC brochure / catalog mirror 给出 eMMC 5.1 line-up，可归纳出
H26M/H26T托管 NAND 结构、容量位和 automotive grade 后缀。 https://netlist.com/wp-content/uploads/2023/06/SK-Hynix_Managed-NAND_eMMC.pdf - SK hynix e-NAND H26M Series datasheet mirror 给出 8GB/16GB/32GB/64GB eMMC 5.1、VCC 3.3V / VCCQ 1.8V、HS400+CMDQ、153FBGA 以及 automotive grade 示例。 https://media.digikey.com/pdf/Data%20Sheets/Netlist%20Inc%20PDF/H26M%20Series.pdf
- SK hynix NAND Flash Databook Q1'2016 mirror 给出 H26M eMMC line-up：4GB MMC4.5、8GB~128GB MMC5.1、1xnm / 3D-V2、base component density、stack 和 package size。 https://gzhls.at/blob/ldb/e/8/b/f/32b2d2b37ba8bac84be3202fa5c6425eb300.pdf
- 规则文件：
packages/core/src/decodepack/rules/packs/skhynix-emmc-token.json - 规则 ID：
vendor.skhynix.emmc.managed.v1 - 优先级：
1005 - testcase：
packages/core/test/decodepack/part-number/skhynix.test.ts
| PN 结构 | 字段 |
|---|---|
H26 + media(1) + density(1) + component(4) + package/config(3) + optional grade |
SK hynix e-NAND / eMMC |
media M / T |
managed e-NAND / eMMC 族 |
density 3/4/5/6/7/8 |
4GB / 8GB / 16GB / 32GB / 64GB / 128GB |
component 1001 |
1xnm, 32Gb die, 1-die, eMMC 4.5 |
component 1204/1208/2208/4208/8208 |
1xnm, 64Gb die, 1/1/2/4/8-die |
component 1002/2002/4002/8002 |
3D-V2, 128Gb die, 1/2/4/8-die |
package/config HPR/FPR/GPR |
153FBGA 11.5x13x0.8mm |
package/config AMR/CMR/EMR |
153FBGA 11.5x13x1.0mm |
grade N/A |
Commercial / Mobile, -25~85°C |
grade I |
Industrial, -40~85°C |
grade X |
Automotive Grade 2/3, -40~105°C |
grade Q |
Automotive Grade 2, -40~105°C |
| 输出字段 | 值 |
|---|---|
vendor |
skhynix |
type |
emmc |
density |
按 density token 映射为 Mbit |
voltage |
VCC: 3.3V, VCCQ: 1.8V |
package |
按 package/config token 输出 153FBGA 与尺寸 |
fields.system |
SK hynix e-NAND |
fields.group |
eMMC |
fields.storage_interface |
eMMC 4.5 / eMMC 5.1 |
fields.interface_type |
HS400+CMD Q |
fields.managed_family |
e-NAND |
fields.generation_info |
1xnm NAND / 3D-V2 NAND |
fields.die_density |
32Gb / 64Gb / 128Gb |
fields.die_count |
1/2/4/8 |
| PN | 解析重点 |
|---|---|
H26M78208CMRX |
eMMC, 64GB, automotive grade token X |
H26M78208CMRN |
eMMC, 64GB, Commercial / Mobile token N |
H26M31001HPR |
eMMC 4.5, 4GB, 1xnm, 32Gb x1, 153FBGA 11.5x13x0.8mm |
H26M88002AMR |
eMMC 5.1, 128GB, 3D-V2, 128Gb x8, 153FBGA 11.5x13x1.0mm |
H26M91208HPRX |
eMMC, unknown density token 9，仍保留 vendor/type/package/grade |
- component token 已按 Q1'2016 databook line-up 拆出 die density / die stack / package size；更细的 controller revision、product serial 仍不解释。
X/Qgrade 语义已按公开资料先收敛到 automotive，但仍需要更多原厂 ordering table 做细分复核。H9*常见于 eMCP / uMCP，已拆分到 skhynix_emcp.md，不应直接并入 eMMC parser。